We continue to work toward sustainable development by reducing our impact on the environment.
Intel is concerned about global environmental problems, including ozone depletion and global warming. We are committed to doing what we can to address these issues as well as sharing our knowledge with other manufacturers.
For example, Intel used more than 300 tons of ozone-depleting chemicals (ODCs) in worldwide manufacturing in 1989, including chlorofluorocarbons and 1,1,1-trichloroethane. Intel eliminated all of its ODC use in manufacturing in 1994 and is now adopting new technologies to eliminate ODCs in non-manufacturing uses such as fire extinguishers and refrigeration, as they are developed.
Semiconductor manufacturers as a group use a small fraction of all global warming gases, including perfluoroethane and perfluoromethane, commonly referred to as perfluorocarbons, or PFCs. We are aggressively working with materials suppliers to eliminate emissions of these gases. For instance, we are developing a first-of-its-kind system, in partnership with one supplier, to collect PFCs after use and send them back to the supplier for reprocessing and reuse. This approach is preferable to "end-of-the-pipe" solutions, which often cause other environmental concerns.
In addition, Intel has played a key role with the Semiconductor Industry Association and the Environmental Protection Agency in developing a voluntary Memorandum of Understanding to identify the environmentally best ways to reduce PFC emissions. Intel expects to sign this agreement in 1996.
One of our greatest contributions to the fight against global warming is perhaps the hardest to quantify: the rapid development of electronic communication supported by Intel technology. This development includes electronic data transmission via e-mail and audio or video conferencing.
According to a survey released by market research firm FIND/SVP in January 1996, 9.5 million Americans use the Internet, with some 4 million getting started in 1995 alone. Considerable amounts of energy and environmental burden are spared by people who forego travel and paper transactions and use electronic communications instead.
We strive to develop products that meet our customers' needs, while enhancing product recyclability and minimizing environmental impact from the use of these products.
Intel also purchases chemicals from suppliers that can help us manage those chemicals, so as to minimize the environmental impact of our manufacturing processes.
In early 1995, Intel's printed circuit board manufacturing facility in Puerto Rico operated 13 production lines, only one of which ran the no-clean process. At the end of 1995, the operation expanded to 20 production lines, 16 of which are running no-clean.
Meanwhile, Intel's board manufacturing operations in Oregon and Ireland have converted 100 percent to no-clean. Here Beatriz Agosto solders components onto a motherboard.
One of our goals is to ensure that each stage of product development creates minimal environmental impacts.
Intel has developed a "product stewardship" program to systematically reduce the environmental impacts of our products during each phase of their life cycle-from raw materials production through product design, manufacturing, marketing, distribution, sales, customer use and ultimate disposal.
To create more environmentally sustainable designs, we collaborated with customers and reviewed other design practices worldwide. As a result, Intel's product design now strives to reduce product energy consumption, weight, volume and packaging; reduce the use of materials used in products and packages; and increase the ease of reusing and recycling parts and products.
Such goals resulted in several product design improvements in 1995, including avoidance of batteries containing cadmium or mercury whenever possible; greater use of snap-on and plug-in fittings to make it easier to take apart computers for part recycling and reuse; printing product manuals with inks free of heavy metals; and offering paper documents in electronic formats.
October 1996 marks the beginning of a voluntary product takeback program throughout Germany. With this program, customers will be able to return electronics products to their supplier or a certified recycling firm, rather than taking them to a landfill.
We continue to support the U.S. EPA's Energy Star Computers program. PCs that qualify for this program go into "sleep" mode when the equipment is not actively being used and draw no more than 30 watts of electricity (not including 30 watts for the monitor) during periods of inactivity. Intel's Pentium processor has been developed so that computers using it can meet Energy Star requirements.
Since 1991, we have been increasing the volume of packaging made from environmentally preferred materials that are reusable, recyclable, and can be disposed of safely and responsibly. In 1995, we developed further packaging improvements. For instance, the cardboard tray in one package was reduced from 8.5 by 11 inches to 7 by 9 inches. The tray will eventually be eliminated. Similarly, we will soon package computer chips in tubes made of just one plastic material and properly marked to increase the tubes' recyclability.
Six new bulk packaging designs for circuit boards were implemented in 1995. These recyclable and reusable packages are smaller in size and have fewer cushioning materials compared to previous designs.
We also emphasize packaging reuse programs. In 1995, we reused about 25 percent of the trays used to ship final computer chips to customers. The goal for 1996 is at least 30 percent. Reels for packaging some of our components are also being reused in collaboration with two major customers. A program for moisture barrier bags is also being developed.
Semiconductors can be recycled to recover precious metals. Intel reuses the silicon wafers that do not go through full processing. In one manufacturing process, we take wafers that cannot be made into microprocessors and reclaim the silicon so it can be used again in manufacturing.
Many of Intel's products and applications can improve conditions around the world and contribute to our efforts to make our cities, and our planet, more sustainable. We conclude with a few examples that demonstrate our deep committment to this cause:
Intel's ProSharex video conferencing product line is one of the leaders in providing interactive video communications using desktop PCs. Teams in two locations can hold "video conferences" during which they can review documents, drawings and objects. Such conferences help to reduce travel and its environmental impacts, as well as bring needed information and expertise to remote locations.
In 1995, Intel agreed to build the world's most powerful supercomputer for the U.S. Department of Energy. This supercomputerwhich will be able to reach a peak of 1.8 trillion floating-point calculations per secondwill be used to simulate nuclear testing and reduce the need for future nuclear testing. More than 9,000 Intel Pentium Pro microprocessors will be used to build this supercomputer; it will be more powerful than all the world's mainframe computers combined. Researchers may also use the supercomputer to sequence the human genome and enhance our understanding of global climate conditions. Another Intel supercomputer is now being used to run a global warming simulation model to predict the impact of global warming gases on climate changes.
Intel contributed $270,000 to a joint project with the United Nations Educational, Scientific and Cultural Organization and Conservation International. Intel's contribution will help equip 25 biosphere reserves with sophisticated computer equipment and access to the Internet global information network. Project scientists will be able to collect and process vast amounts of data with the goal of preserving these ecosystems.
Rural physicians in South Africa have used Intel ProShare video conferencing to confer with medical experts about diagnoses and treatment for sick children. Such medical support may not be accessible or affordable otherwise in developing countries.
Between 1991 and 1995, Intel's Chandler facility expanded the amount of solid waste it recycled from 20 percent to 51 percent. To accommodate the increase, the facility expanded its recycling yard from 3,700 square feet to 17,000 square feet.